NTTFS4937N
TYPICAL CHARACTERISTICS
2800
2600
2400
2200
2000
1800
1600
1400
1200
1000
800
C iss
C oss
V GS = 0 V
T J = 25 ° C
11
10
9
8
7
6
5
4
3
T J = 25 ° C
Qgd
Qgs
QT
600
400
200
0
0
5
C rss
10
15
20
25
30
2
1
0
0
2
4
6
V DD = 15 V
V GS = 10 V
I D = 20 A
8 10 12 14 16 18 20 22 24 26 28 30 32
1000
V DS , DRAIN ? TO ? SOURCE VOLTAGE (V)
Figure 7. Capacitance Variation
30
Qg, TOTAL GATE CHARGE (nC)
Figure 8. Gate ? to ? Source and
Drain ? to ? Source Voltage vs. Total Charge
100
10
V DD = 15 V
I D = 15 A
V GS = 10 V
t d(off)
t f
t r
t d(on)
25
20
15
10
V GS = 0 V
T J = 125 ° C
5
1
1
10
100
0
0.4
0.5
0.6
0.7
T J = 25 ° C
0.8
0.9
1.0
1000
R G , GATE RESISTANCE ( W )
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
70
V SD , SOURCE ? TO ? DRAIN VOLTAGE (V)
Figure 10. Diode Forward Voltage vs. Current
100
10 m s
60
50
I D = 37 A
10
100 m s
1 ms
40
1
0.1
V GS = 20 V
Single Pulse
T C = 25 ° C
R DS(on) Limit
Thermal Limit
10 ms
dc
30
20
10
Package Limit
0.01
0.01 0.1
1
10
100
0
25
50
75
100
125
150
V DS , DRAIN ? TO ? SOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
http://onsemi.com
5
T J , STARTING JUNCTION TEMPERATURE ( ° C)
Figure 12. Maximum Avalanche Energy vs.
Starting Junction Temperature
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